In March 2021, the silicon wafer polishing liquid clean room project of Jiangsu Shanshui Semiconductor Technology Co., Ltd. contracted by our company was successfully completed and passed the completion acceptance and has been delivered for use.

On April 9, 2021, Yixing Economic Development Zone signed a strategic cooperation agreement with Hebei University of Technology. Relying on the deepening of cooperation between government, industry, education and research, in September 2021, the Shanshui Semiconductor Silicon Wafer Polishing Fluid Project began to land industrialization construction. In July 2022, the Shanshui Semiconductor Phase II integrated circuit CMP special nano abrasive technical transformation project with a total investment of 500 million yuan signed by Yixing Economic Development Zone, Jiangsu Shanshui Semiconductor Technology Co., Ltd. and Hebei University of Technology can achieve a production capacity of 4500 tons / year for high-end CMP polishing fluid special abrasives after completion, which can effectively break the monopoly of foreign technology, fill the domestic gap, and at the same time provide Shanshui Semiconductor Phase I silicon wafer polishing liquid. Projects such as silica polishing fluid and integrated circuit metal interconnect polishing fluid provide raw material support, effectively solve the problem of CMP special nano abrasives for the key raw material of polishing fluid being "stuck neck" at the source, and realize the independent controllability of key CMP materials upstream of integrated circuits. The project is expected to have an annual output value of more than 1.7 billion yuan in the future.